Shin-Etsu Silicones to showcased key thermal interface materials at 2024 Battery Show
Responding to the rapid growth and increasing importance in the global battery and EV sectors, Shin-Etsu Silicones of America (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) showcased their SDP-6560 A/B liquid-dispensed gap filling, non-adhesive curing silicone thermal interface material (TIM) at the largest battery technology expo in North America, the 2024 Battery Show held in Detroit. Part of the high performing SDP Series, which are two-part, room-temperature cure silicone-based materials, the product acts as a thermal interface gap filler−providing exceptional thermal conductivity and excellent insulation for electronics applications requiring thermal dissipation.
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