AGC to feature advanced melt processable fluoroelastomer compounds at IEC 2023

Exton, PA – Fluon+™ flexible AR melt processable compounds are based on a modified ETFE copolymer and a unique fluoroelastomer. These grades maintain many of the desirable properties of ETFE, like excellent heat and chemical resistance, but are more flexible than other fluoropolymers. These materials are used in many applications including wire and cable, films and sheets, tubing and pipe, and electronic components.

Fluon+ flexible AR melt processable compounds are ideal alternatives to THV in formulations because they are resistant to fuels and chemicals, exhibit toughness and flexibility, and have a wide service temperature range. These customizable compounds are readily available as a highly suitable replacement for THV.
AGC Chemicals Americas will feature Fluon+ flexible AR melt processable compounds at the International Elastomer Conference 2023, booth 100, October 17–19 in Cleveland, Ohio.

Also at the event, AGC will showcase AFLAS® fluoroelastomer grades that are proven to improve the performance of parts and components that need to perform reliably in the harshest environments. For example, AFLAS 400E and 600X FEPM fluoroelastomer grades are designed for multilayer hose constructions and other critical parts used in high-pressure, high-temperature environments. Because they are resistant to NOx, SOx, engine oils and other aggressive fluids, they enhance the performance of hardworking equipment components in oil and gas recovery applications including durable packers, bladders, gaskets and O-rings.
AGC also will highlight AFLAS FFKM PM-3500 perfluorinated elastomer, which provides exceptional high-temperature, high-pressure performance to equipment parts that operate in the most challenging conditions. This peroxide-curable material was specifically developed for applications such as chamber seals and centering O-rings in flanges where high purity is vital. It achieves Shore A hardness without the need for fillers that could generate particulates. It is also plasma resistant, so it can be used in the etching process of semiconductor manufacturing.
Expanding on the AFLAS FFKM product line are two new grades to be introduced at IEC: PM-5000 and PM-5500. Both solutions are nitrile curable and have ultra-low metal content. They can support a wide range of applications depending on needs including high-temperature durability and O2 and NF3 plasma resistance. PM-5000 offers lower compression set and adhesive force, whereas PM-5500 has a higher molecular weight and hardness, which is achieved without the use of fillers.
For more information about AGC’s wide range of materials solutions, visit agcchem.com/products.