Trelleborg launches fluorosurfactant-free semiconductor sealing materials

Trelleborg, Sweden – Trelleborg Sealing Solutions has launched three fluorosurfactant-free materials for semiconductor manufacturing as regulators and manufacturers increasingly focus on reducing the use of per- and polyfluoroalkyl substances, or PFAS.

The new materials expand Trelleborg’s PureFab range and include two perfluoroelastomers, or FFKMs, JPF50 and JPF58, and a fluoroelastomer, VPF20. The company said the materials are made without low-molecular-weight PFAS fluorosurfactants and are intended to help customers address evolving regulatory requirements while maintaining performance and durability.

Chris Busby, Trelleborg’s global segment director for semiconductor, said the materials are designed to help customers prepare for changes in PFAS regulations and strengthen their supply chains.

The JPF50 material is a high-purity FFKM designed for semiconductor processes requiring purity and plasma resistance. Trelleborg said it is manufactured without fillers or fluorosurfactants and offers low outgassing and minimal particle emissions. The material can operate at temperatures up to 300 degrees Celsius, or 572 degrees Fahrenheit, and is designed to provide low compression set and mechanical strength.

JPF50 is intended for deposition processes such as plasma-enhanced chemical vapor deposition, high-density plasma chemical vapor deposition and plasma-enhanced atomic layer deposition. It can also be used in atomic layer etching and dry etching processes, including chamber lid, gas inlet and bonded slit valve door seals.

JPF58 is an FFKM designed for applications requiring long-term thermal stability and purity at extreme temperatures. According to Trelleborg, it maintains seal integrity at temperatures up to 300 C and resists cracking under high mechanical and thermal stress. The material is intended for high-temperature processes including rapid thermal processing, atomic layer deposition, chemical vapor deposition and diffusion furnaces.

The third material, VPF20, is a high-purity FKM that combines a fluorosurfactant-free base polymer with high-purity synthetic fillers. Trelleborg said the formulation helps minimize metallic contaminants and ionic extractables while providing mechanical strength, elastic recovery and chemical resistance.

VPF20 is designed for both static and dynamic sealing applications and is positioned as a more cost-effective alternative to FFKM for applications involving moderate temperatures and medium chemical demands. Potential applications include transfer modules, load locks, equipment front-end modules, vacuum handling systems and flat-panel display manufacturing equipment.

Trelleborg said the broader PureFab portfolio is designed for aggressive semiconductor front-end processes, including deposition, etching, ash and strip, plasma cleaning and thermal processing.

The company defines its fluorosurfactant-free materials as products in which PFAS fluorosurfactants are not intentionally used. Trelleborg said that, based on available information, the materials do not contain PFAS fluorosurfactants, although it cannot guarantee that trace amounts occurring unintentionally are absent.

Trelleborg said customers interested in the new materials can arrange samples for testing.