Denka launches low dielectric organic insulating resin with the electrical properties

Tokyo, Japan – Denka launches Snecton, a low dielectric organic insulating resin with the electrical properties (low dielectric constant and low dielectric loss tangent) required of materials to reduce the loss of electrical signals (transmission loss) in next-generation high-speed communications (Beyond 5G and 6G).

The sales of this product have started for copper-clad laminates (CCL) for various high-speed communications equipment. In addition, the adoption of this product for flexible copper-clad laminates (FCCL) and various interlayer insulating materials is now under consideration for its features of remaining soft even after full
curing. This product is further expected to find application in a wide range of fields, including PCs, smartphones, data centers, mobile phone base stations, wearable terminals, and automobiles.

The Denka Group has been committed to focusing on the ICT & Energy field in its eight-year Management Plan “Mission 2030,” which covers the fiscal period from 2023 to 2030. In its business efforts, SNECTON will meet the needs of society and our customers as a core material for the telecommunications and energy fields.