Wevo launches supersoft silicone potting compounds for advanced electronics

Ostfildern-Kemnat, Germany – Wevo has unveiled three new silicone-based potting compounds designed to meet the growing demands of modern electronic components. The WEVOSIL 22106 FL, 22102 FL, and 22105 FL compounds offer a unique combination of supersoft consistency, thermal conductivity, and mechanical resilience, making them ideal for sensitive and thermally demanding applications.

With a cured hardness of approximately 60 Shore 00, the new WEVOSIL 2210x series provides exceptional damping of mechanical stresses such as vibration and shock. This makes them particularly suitable for protecting delicate components like wire bonds and inductive elements, including chokes and transformers, whether or not they incorporate ferrite cores.

Each of the three variants is engineered with a specific thermal conductivity profile to suit different application needs:

WEVOSIL 22106 FL: Offers a thermal conductivity of 0.5 W/m-K and a low density of 1.38 g/cm³, ideal for weight-sensitive applications requiring moderate heat dissipation.

WEVOSIL 22102 FL: With a conductivity of 1.0 W/m-K and density of 1.68 g/cm³, it balances thermal performance and material mass.

WEVOSIL 22105 FL: Delivers the highest thermal conductivity at 1.5 W/m-K and a density of 2.61 g/cm³, making it suitable for high-temperature environments and components with significant heat output.

All three compounds are rated for long-term temperature resistance between 180 °C and 200 °C, ensuring durability in thermally intensive settings.

Thanks to their high flowability and low viscosity (under 5,000 mPa·s), the WEVOSIL 2210x materials enable precise, bubble-free potting even in small or complex geometries. This enhances production efficiency and reliability, particularly in applications such as EMI/Pi filters, PFC circuits, and electronic control units (ECUs) used in electric vehicles and rail systems.

Wevo’s latest innovation underscores its commitment to advancing electronic component protection through materials that combine mechanical flexibility, thermal efficiency, and ease of processing.